array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6239" } Degradation of the die attach layer in chip-on-board packaged light-emitting diodes during temperature cycling - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Degradation of the die attach layer in chip-on-board packaged light-emitting diodes during temperature cycling

2015
会议 2015 16th International Conference on Electronic Packaging Technology (ICEPT)
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