High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN - Novel Semiconductor Devices and Reliability Lab | LabXing

array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6291" } High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

2008

期刊 Chinese Physics Letters

作者 Zhang Yue-Zong · Feng Shi-Wei · Guo Chun-Sheng · Zhang Guang-Chen · Zhuang Si-Xiang · Su Rong · Bai Yun-Xia · Lu Chang-Zhi

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卷 25
期 11
页码 4083-4085
IOP Publishing
ISSN: 0256-307X
DOI: 10.1088/0256-307x/25/11/067

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