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#Bangbing Shi
Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Variation of Dominant Degradation Mechanism in AlGaN Barrier Layer With Different Voltage Stress on the Gate of AlGaN/GaN High Electron Mobility Transistors
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Temperature distribution measurement based on field-programmable gate array embedded ring oscillators
Novel Semiconductor Devices and Reliability Lab , 北京工业大学