#Xuesong Xie

The thermal characterization of packaged semiconductor device

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of channel temperature of AlGaN/GaN HEMT by electrical method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal Analysis of the Multi-Chip Vertical Packaged White LED

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Interface states mediated reverse leakage through metal/AlxGa1−xN∕GaN Schottky diodes

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The study on the thermal behavior of packaged power LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

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