#Yunong Liu

Non-destructive peak junction temperature measurement of double-chip IGBT modules with temperature inhomogeneity

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Multi-physics field coupling simulation modeling and analysis of StakPak insulated gate bipolar transistor device

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

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