3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias - M.AI.N GROUP | LabXing

array(2) { ["lab"]=> string(3) "126" ["publication"]=> string(4) "1119" } 3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias - M.AI.N GROUP | LabXing

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3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias

2016

期刊 Journal of Microelectromechanical Systems

作者 Yuxin Du · Dong Wu · Zhen Song · Miao Liu · Sujie Yang · Zheyao Wang

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卷 25
期 4
页码 770-779
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 1057-7157
DOI: 10.1109/jmems.2016.2563522

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