#Zheyao Wang

Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride

M.AI.N GROUP , 清华大学

3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias

M.AI.N GROUP , 清华大学

Thermal Reliability Tests of Air-Gap TSVs With Combined Air-SiO2Liners

M.AI.N GROUP , 清华大学

Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner

M.AI.N GROUP , 清华大学

Air-gap/SiO<inf>2</inf> liner TSVs with improved electrical performance

M.AI.N GROUP , 清华大学

Thermal and electrical tests of air-gap TSV

M.AI.N GROUP , 清华大学

Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

M.AI.N GROUP , 清华大学

A novel manufacturing scheme for TSVs with porous polymer insulation liners

M.AI.N GROUP , 清华大学

Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias

M.AI.N GROUP , 清华大学

Air-Gap Through-Silicon Vias

M.AI.N GROUP , 清华大学

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