Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners - M.AI.N GROUP | LabXing

array(2) { ["lab"]=> string(3) "126" ["publication"]=> string(4) "1124" } Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners - M.AI.N GROUP | LabXing

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Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

2013

期刊 Microelectronics Reliability

作者 Qianwen Chen · Wuyang Yu · Cui Huang · Zhimin Tan · Zheyao Wang

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卷 53
期 5
页码 725-732
Elsevier BV
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.12.012

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