#Qianwen Chen

Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner

M.AI.N GROUP , 清华大学

Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

M.AI.N GROUP , 清华大学

Air-Gap Through-Silicon Vias

M.AI.N GROUP , 清华大学

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