array(2) { ["lab"]=> string(3) "126" ["publication"]=> string(4) "1125" } A novel manufacturing scheme for TSVs with porous polymer insulation liners - M.AI.N GROUP | LabXing
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A novel manufacturing scheme for TSVs with porous polymer insulation liners

2016
会议 2016 17th International Conference on Electronic Packaging Technology (ICEPT)
作者 Ke Wu · Zheyao Wang
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