Strain distribution and electrical characteristics of flexible low-temperature polysilicon thin film transistors under biaxial bending - Novel Semiconductor Devices and Reliability Lab

Abstract This paper investigates the strain distribution of flexible p-channel low temperature polycrystalline silicon thin film transistors under biaxial bending. The strain distribution of LTPS TFTs under different bending conditions is analysed by finite element analysis. 𝛆r and 𝛆θ are essentially equal and constant within the load ring. The finite element analysis shows that when the biaxial bending strain condition is 2.5%, the strain distribution is mainly concentrated at the contact angle between the electrode and the oxide layer. This strain is significantly greater than the overall strain of the device, which is the main reason for the bending performance of the device. We found that under biaxial bending, the threshold voltage shifts towards the negative axis as the biaxial strain increases. Within this strain range, these electrical properties are evident under biaxial strain conditions. Comparing theoretical threshold voltage shifts based on energy band changes with experimental results under biaxial strain, it was found that changes in trap density should also contribute to the threshold voltage shift.