#Zenglin Wang

2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating

可再生能源先进材料与器件实验室 , 兰州交通大学

A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode

可再生能源先进材料与器件实验室 , 兰州交通大学

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