array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(5) "12335" } Non-destructive testing of heteromorphic workpiece brazing layer quality based on heat conduction - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Non-destructive testing of heteromorphic workpiece brazing layer quality based on heat conduction

2021
会议 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME)
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