Thermal analysis of multiple light sources based on the superposition method

array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(5) "15261" } Thermal analysis of multiple light sources based on the superposition method - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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2014

会议 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

作者 Dong Shi · Shiwei Feng · Yamin Zhang · Junwei Yang

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IEEE
DOI: 10.1109/icsict.2014.7021444

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