Thermal investigation of LED array with multiple packages based on the superposition method

array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6245" } Thermal investigation of LED array with multiple packages based on the superposition method - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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2015

期刊 Microelectronics Journal

作者 Dong Shi · Shiwei Feng · Yamin Zhang · Yanbin Qiao · Bing Deng

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卷 46
期 7
页码 632-636
Elsevier BV
ISSN: 0026-2692
DOI: 10.1016/j.mejo.2015.03.010

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