array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6290" } The study on the thermal behavior of packaged power LEDs - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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The study on the thermal behavior of packaged power LEDs

2008
会议 2008 9th International Conference on Solid-State and Integrated-Circuit Technology
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