#Jingwan Li


Quick screen of thermal resistance for batching high brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal stability evaluation of die attach for high brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学