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#Jingwan Li
Quick screen of thermal resistance for batching high brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Determination of channel temperature for AlGaN/GaN HEMTs by high spectral resolution micro-Raman spectroscopy
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal stability evaluation of die attach for high brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学