A new method for detecting heteromorphic workpiece brazing layer quality based on thermal probe - Novel Semiconductor Devices and Reliability Lab | LabXing

array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(5) "12325" } A new method for detecting heteromorphic workpiece brazing layer quality based on thermal probe - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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A new method for detecting heteromorphic workpiece brazing layer quality based on thermal probe

2021

期刊 Review of Scientific Instruments

作者 Chaoxu Hu · Shiwei Feng · Yamin Zhang · Xin He · Kun Bai · Sheng Wang · Shijie Pan

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卷 92
期 8
页码 084902
AIP Publishing
ISSN: 0034-6748
DOI: 10.1063/5.0054559

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