#Chunsheng Guo

Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of post-deposition annealing pressure on bipolar resistive switching in RF sputtered BiFeO<inf>3</inf>/Nb:SrTiO<inf>3</inf> heterostructure

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Bipolar Resistive Switching Effect in BiFeO3/Nb:SrTiO3 Heterostructure by RF Sputtering at Room Temperature

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Substrate thinning and external stress effect on the output characteristics of AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Study of Heat Transport Behavior in GaN-Based Transistors by Schottky Characteristics Method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Cycled Thermomechanical Failure in 808-nm High-Power AlGaAs/GaAs Laser Diode Bars

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determining Drain Current Characteristics and Channel Temperature Rise in GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Quick screen of thermal resistance for batching high brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of channel temperature for AlGaN/GaN HEMTs by high spectral resolution micro-Raman spectroscopy

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The channel temperature dependence of drain transient response in AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Identifying the failure mechanism in accelerated life tests by two-parameter lognormal distributions

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The impact of the stress induced by lateral spatial hole burning on the degradation of broad-area AlGaAs/GaAs laser diodes

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal resistance analysis related to the degradation of GaAs-Based laser diodes

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal Analysis of GaAs-Based High Power Laser Diodes Related to Degradation

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal stability evaluation of die attach for high brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of channel temperature of AlGaN/GaN HEMT by electrical method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal analysis of high power LED array system

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal Analysis of the Multi-Chip Vertical Packaged White LED

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of Uniaxial Tensile Strains at Different Orientations on the Characteristics of AlGaN/GaN High-Electron-Mobility Transistors

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Study of traps in low-temperature polysilicon thin film transistors using a current transient method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Non-destructive peak junction temperature measurement of double-chip IGBT modules with temperature inhomogeneity

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Measuring Junction Temperature Inhomogeneity of Double-chip IGBT Modules by Electrical Method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Multi-physics field coupling simulation modeling and analysis of StakPak insulated gate bipolar transistor device

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Real-time measurement and control of junction temperature of VDMOS in power cycle test

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal analysis of ICs based on equivalent thermal resistance

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Structure optimization of heat sink for high power LED street lamp

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Analysis of degradation of GaN-Based light-emitting diodes

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Experimental study on the reliable working life of PUF chip for 8 years

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal analysis of ICS based on equivalent thermal resistance and skill language

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Reliability of solder joints in High-power LED package in power cycling tests

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The investigation of failure mechanism of n-GaN/Ti/Al/Ni/Au ohmic contact by novel TLM

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of Biaxial Bending Strains on the Electrical Characteristics of Flexible Low-Temperature Polysilicon Thin-Film Transistors

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Study of the temperature distribution in insulated gate bipolar transistor module under different test conditions

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Influence of heat source size on thermal resistance of AlGaN/GaN HEMT

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The thermal properties of AlGaAs/GaAs laser diode bars analyzed by the transient thermal technique

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Measurement Deviation of the Virtual Junction Temperature by the Saturation Voltage Drop Method for Insulated-Gate Bipolar Transistors

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effects of Static and Repetitive Uniaxial Bending Strains on the Electrical Properties and Trap Characteristics of Flexible Low-Temperature Polysilicon Thin-Film Transistors

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation

Novel Semiconductor Devices and Reliability Lab , 北京工业大学